Thick film component along with overlay technique is a very cost effective technique for characterization of materials in any form or size. For biomaterials like seeds which vary from sample to sample, this technique is very useful for dielectric characterization and moisture content determination. The overlay technique on a non-resonant microstripline, Ag thick film equilateral triangle microstrip patch antenna, VSWR and wave-guide technique has been used to predict the permittivity, conductivity, dielectric and moisture sensor especially for biomaterials, since any size and shape of the overlay can be used.